Wireless Performance

•Signal
–Signal Quality
–Signal Reliability
–Signal Security
•Link
–Link Quality
–Link Reliability
–Link Security
•Service
–Quality of Service
–Reliability of Service
–Security of Service

Reliability Tests

•Vibration/Impact-Shock
–Acoustic/Mechanical Analysis
•Temperature/Heat-Shock
–Thermal Analysis
•Electromagnetic-Interference/ Electromagnetic-Pulse
–Electromagnetic (EM) Analysis
•Signal Integrity/Power Integrity
–Voltage-Current (VI) Analysis

模糊度紊亂度當量(equivalency between fuzziness and randomness)

•模糊度/渾沌度(fuzziness)
–模糊/渾沌(fuzzy)
–模糊理論/渾沌理論(fuzzy theory)
–歸屬度函數(membership function)
–混淆(ambiguity)
–並非不可能(possible)
•紊亂度(randomness)
–隨機(stochastic)
–機率(probability)
–密度函數(density function)
–誤差(error)
–有可能(probable)

隔離網(Mesh) vs. 隔離板(Sheet)

•Assumption, the Minimum Operating Wavelength,
–Lambda = 3e8/2e9 = 0.15m (@2GHz)
•Rule of Thumb, the Required Diameter of Mesh,
–D < Lambda/32 = 1.5/32 = 4.6875e-3m = 0.4675cm (less than 2GHz)

Coexistence Handshake

•WiFi Side
–Handshake by wires (Host interface SDIO or User interface GPIO) to inform bluetooth or to be informed by bluetooth the events or the schedule, then drive WiFi networking on the rule of priority
•Bluetooth Side
–Handshake by wires to inform WiFi or to be informed by WiFi the events or the schedule, then drive bluetooth communications on the rule of priority

Power-Saving Wakeup

•Client Side
–Client WiFi PHY/MAC wakes up slept Host CPU via host SDIO or customer GPIO interfaces
•Host Side
–Host CPU wakes up slept Client WiFi PHY/MAC via host SDIO or customer GPIO interfaces

連續波vs.脈衝波

•類比廣播電台(Broadcast Base Station)多發射連續波
•數位無線電基地台(Wireless Base Station)多發射脈衝波
•如連續波(Continuous Waves)與脈衝波(Pulsed Waves)之峰值功率相同，則前者之平均功率較高，高平均功率波對其他需相容(Compatible)設備或需接近人員，能產生具破壞或傷害性的熱效應(Thermal Effect)
•如脈衝波(Pulsed Waves)與連續波(Continuous Waves)之平均功率相同，則前者之峰值功率較高；高峰值功率波對其他需相容(Compatible)設備或需接近人員，可能產生更具破壞或傷害性的燒穿或熱擊效應(Burn-Through or Thermal Shock Effect)

基地台有關輻射傷害效應、輻射安全檢查、以及輻射防護措施之三項迷思

•迷思一：僅比對安全功率密度足以保障全部輻射安全
–安全功率密度值對熱效應以外之傷害不足以提供限制條件
–安全磁通密度值較能對細胞染色體病變之傷害提供限制條件
–相對而言，電場強度及功率密度對人體較具物理效應，磁通密度較具生化效應
•迷思二：可以由所有功率密度測量值正確導出磁通密度，進而可以比對安全磁通密度值
–真正功率密度測量儀器之感測器應直接感測輻射熱效應，並轉換為功率密度值讀出，理論上分析電場與磁場個別成分困難，故由功率密度測量值無法正確還原磁通密度值
–部份高頻功率密度測量儀器之感測器或天線以感測電場強度為主，測量所得功率密度值不含磁通密度因子，故由功率密度測量值較難還原磁通密度值
–部份低頻功率密度測量儀器之感測器或天線以感測磁通密度為主，測量所得功率密度值含磁通密度因子，故由功率密度測量值還原磁通密度值可行
•迷思三：僅比對功率密度測量值，足以評估屏蔽體對電場強度暨對磁通密度之雙重隔離效果
–屏蔽體與吸收體一樣都有隔離效果
–屏蔽體對電場強度暨對磁通密度隔離效果有別，一般銅板銅網隔離電場有效，鐵板鐵網隔離隔離磁場有效，合金、鍍金、或包金材料效果折中
–不漏電不保證不漏磁，反之亦然，故為正確評估隔離屏蔽，必須同時比對安全功率密度，以及比對磁通密度

基地台改善及防護措施效果評估

•改善措施
–天線方位調大60°，衰減效果改善10times or 10dB
–天線方位調大90°，衰減效果改善100times or 20dB
–天線距離調遠3.16times ，衰減效果改善10times or 10dB
–天線距離調遠10times ，衰減效果改善100times or 20dB
•防護措施
–增設一層吸收體，隔離效果增添10times or 10dB防護
–增設一層屏蔽體，隔離效果增添100times or 20dB防護

基地台自由空間輻射安全距離

•假設發射功率輸出為
–Po=43dBm=13dBW=2,000mW=20W
•假設發射天線增益為
–G=14dBi=25.1times (@900MHz)
–G=17dBi=50.1times (@1,800MHz)
•假設天線斜視損失為
–A=0dB=1times (@bore-sight in horizontal plane)
–A=3dB=2times (@±32.5°off bore-sight in horizontal plane)
–A=10dB=10times (@±60°off bore-sight in horizontal plane)
–A=20dB=100times (@±120°off bore-sight in horizontal plane)
•自由空間條件
–發射體周圍、接收體周圍、及發射體至接收體有效路逕以空氣為介質，且均無遮蔽物、反射物、折射物、繞射物、散射物
•輻射遠場與輻射近場條件(反之為感應近場條件)
–R>l/2p=(3e8/900e6)/(2x3.14159)=0.0531m (@900MHz)
–R>l/2p=(3e8/1800e6)/(2x3.14159)=0.0265m (@1,800MHz)
•計算自由空間輻射遠場與輻射近場之安全距離為
–R=[(30xPoxG/A)^(1/2)]/E=[(30x20x25.1/1)^(1/2)]/41.2=2.98m (@900MHz and bore-sight)
–R=[(30xPoxG/A)^(1/2)]/E=[(30x20x25.1/2)^(1/2)]/41.2=2.11m (@900MHz and ±32.5°off bore-sight)
–R=[(30xPoxG/A)^(1/2)]/E=[(30x20x25.1/10)^(1/2)]/41.2=0.943m (@900MHz and ±60°off bore-sight)
–R=[(30xPoxG/A)^(1/2)]/E=[(30x20x25.1/100)^(1/2)]/41.2=0.298m (@900MHz and ±90°off bore-sight)
–R=[(30xPoxG/A)^(1/2)]/E=[(30x20x50.1/1)^(1/2)]/58.2=2.98m (@1,800MHz and bore-sight)
–R=[(30xPoxG/A)^(1/2)]/E=[(30x20x50.1/2)^(1/2)]/58.2=2.11m (@1,800MHz and ±32.5°off bore-sight)
–R=[(30xPoxG/A)^(1/2)]/E=[(30x20x50.1/10)^(1/2)]/58.2=0.943m (@1,800MHz and ±60°off bore-sight)
–R=[(30xPoxG/A)^(1/2)]/E=[(30x20x50.1/100)^(1/2)]/58.2=0.298m (@1,800MHz and ±90°off bore-sight)

基地台自由空間輻射路逕損失

•自由空間條件
–發射體周圍、接收體周圍、及發射體至接收體有效路逕以空氣為介質，且均無遮蔽物、反射物、折射物、繞射物、散射物
•輻射遠場與輻射近場條件(反之為感應近場條件)
–R>l/2p=(3e8/900e6)/(2x3.14159)=0.0531m (@900MHz)
–R>l/2p=(3e8/1800e6)/(2x3.14159)=0.0265m (@1,800MHz)
•自由空間輻射路逕損失
–L=(4pR/l)^2=[4x3.14159x0.0531/(3e8/900e6)]^2=4.01=6.03dB (@900MHz and R=0.0531m)
–L=(4pR/l)^2=[4x3.14159x0.1062/(3e8/900e6)]^2=16.03=12.05dB (@900MHz and R=0.0531x2=0.1062m)
–L=(4pR/l)^2=[4x3.14159x0.531/(3e8/900e6)]^2=400.7=26.03dB (@900MHz and R=0.0531x10=0.531m)
–L=(4pR/l)^2=[4x3.14159x0.0265/(3e8/1800e6)]^2=3.992=6.01dB (@1800MHz and R=0.0265m)
–L=(4pR/l)^2=[4x3.14159x0.0531/(3e8/1800e6)]^2=16.03=12.05dB (@1800MHz and R=0.0265x2=0.0531m)
–L=(4pR/l)^2=[4x3.14159x0.265/(3e8/1800e6)]^2=399.2=26.01dB (@1800MHz and R=0.0265x10=0.265m)
•結論
–輻射與感應臨界點路逕損失為4times or 6dB
–路逕增減兩倍損失增減4times or 6dB
–路逕增減十倍損失增減100times or 20dB

基地台自由空間安全場強與通密

•假設安全功率密度為
–Pd=0.45mW/cm^2=4.5W/m^2 (@900MHz)
–Pd=0.9mW/cm^2=9W/m^2 (@1,800MHz)
•假設自由空間permittivity為
–e=8.854e-12f/m
•假設自由空間permeability為
–m=1.257e-6h/m
•假設自由空間特性阻抗為
–h=(m/e)^(1/2)=377W
•自由空間條件
–空間以空氣為介質
•計算自由空間安全電場強度為
–E=(Pdxh)^(1/2)=(4.5x377)^(1/2)=41.2V/m (@900MHz)
–E=(Pdxh)^(1/2)=(9x377)^(1/2)=58.2V/m (@1,800MHz)
•計算自由空間安全磁場強度為
–H=(Pd/h)^(1/2)=(4.5/377)^(1/2)=0.109A/m (@900MHz)
–H=(Pd/h)^(1/2)=(9/377)^(1/2)=0.155A/m (@1,800MHz)
•計算自由空間安全電通密度為
–D=exE=8.854e-12x41.2=0.365nCoulomb/m^2 (@900MHz)
–D=exE=8.854e-12x58.2=0.515nCoulomb/m^2 (@1,800MHz)
•計算自由空間安全磁通密度為
–B=mxH=1.257e-6x0.109=0.136mWeber/m^2=0.136mTesla=1.36mGauss (@900MHz)
–B=mxH=1.257e-6x0.155=0.195mWeber/m^2=0.195mTesla=1.95mGauss (@1,800MHz)

基地台扇形天線軸向 (Sectored Antenna Bore-sight)

•正前方
–大於半功率(3dB)函蓋範圍
–水平面約65°
–垂直面約6.5°
•扇形責任區前方
–大於十分之一功率(10dB)函蓋範圍
–水平面約120°
–垂直面約12°
•有效前方
–大於百分之一功率(20dB)函蓋範圍
–水平面約180°
–垂直面約18°/主波束(或65°~120°/主波束附帶旁波葉)

無線電基地台廢台協調服務需求

•工程資料與現場解說
•法規與案例謬誤引據糾正
•醫學文獻與報導謬誤引據糾正
•測試結果謬誤引據糾正
•勘查舉證及建議
•移機成功機率評估
•改善措施效益評估

無線電基地台建台協調服務需求

•偽裝(Conforming)美化(Beatifying)兩用(Dual-use)工程規劃咨詢
•改善工程規劃咨詢
•法規與案例釋疑
•醫學文獻與報導釋疑
•測試結果釋疑
•心理輔導

The Relative Radiating Powers from Cellular Phone(手機) and its Base-station(基地台)

•The relative radiating power of a near base-station is higher than that of a far base-station
•The relative radiating power of mobile-station (cellular phone) is stronger than that of base-station
•The relative radiating power of mobile-station while connecting with a far base-station is stronger than with a near base-station
•The relative radiating powers of mobile-station while searching for (during just switching on) or acquiring (during handover) a new base-station (with the scale of 1,000mGuass and greater) are higher than while connecting with (during well handoff) an old base-station (with the scale of 10mGuass and greater)

What do we learn from the history of TV, PC and Telephone?

•TV and TV Remote-controller
–versus MDTV
•PC plus PC Side-show
–versus UMPC
•Telephone and Cordless Telephone
–versus Mobile-telephone

Is SiP ready to go broadband applications?

•Who can provide flip-chip chipset for 802.11n (or High-throughput-WiFi) now?
•Who can provide flip-chip chipset for 802.16e (or Mobile-WiMAX) now?
•Who can provide flip-chip chipset for UWB, former 802.15.3a (or Wireless-USB, WiNET of WiMedia, Bluetooth 3.0) now?

Do you think UWB+802.11n+802.16e SoB Combo module works for Portable or Mobile PCs?

•All are broadband?
•All are wireless?
•Cover all areas? WPAN plus WLAN plus WMAN?

Chip mounting technologies for SiP module

•QFN-Packaged-Chip-on-Board
•LGA-Packaged-Chip-on-Board
•BGA-Packaged-Chip-on-Board
•Chip-Scale-Package-Chip-on-Board
•Wire-Bounded-Chip-on-Board
•Flip-Chip-on-Board

科學勘查與化解 (二)

•儀器間接量測法 (Indirect Method to Test)
–Site I (Chamber)
•Testing sensor
•Testing cable
•Directional coupler
•Attenuator
•Testing instrument to measure power from directional coupler by testing sensor
–Site II (Field)
•Testing antenna
•Testing transmission-line
•Testing instrument to measure power density from space by testing antenna (suppose that the sensitivity of the instrument which can measure power density is better than that of the instrument which can measure power directly)
–Procedure
•Measure the first power density at site II-1 and derive the regarding first power
•Measure the corresponding power from directional coupler at site I, calculate the first power referring to site II-1, and record the first power difference between two measurements
•Monitor the second power density at site II-2, adjust attenuator at site I such that the second power density at site II-2 is equal to the first power density at site II-2, read the corresponding power from directional coupler at site I, and record the attenuation offset from attenuator
•The second power is equal to the first power offset by attenuation and with tolerance of that first power difference
•Error analysis: if the environments of site II-1 and II-2 are totally different, then calculation using same rule-of-thumb propagation model for site II-1 and II-2 may generate big error.
•儀器比較量測法 (Comparison Method to Test)
–Reference emitter for comparison
–Reference isolator for comparison
–Error analysis: if any of reference emitter and/or reference isolator are not well calibrated, then the measurement which uses any may generate error.

科學勘查與化解 (一)

•公式計算法 (Calculation Method)
–Antenna gain of the emitter under test
–Isolator attenuation
–Transmission-line loss of the emitter under test
–Transmitting output power of the emitter under test
–Propagation loss
–Calculate individual power by using rule-of-thumb propagation model
–Summate the powers
–Error analysis: Using wrong propagation model may generate error.
•儀器直接量測法 (Direct Method to Test)
–Testing sensor or antenna
–Testing cable or transmission-line
–Testing instrument to measure power or power density from testing sensor or antenna
–Measure individual powers, or measure individual power densities and derive respective powers from them
–Summate the powers
–Subtract of the power without isolation from the power with isolation
–Error analysis: if either the sensitivity of power test instrument is not sufficient or if the resolution of power density test instrument is not sufficient, then the measurement which uses either one may generate error.

RF Power Measurements of Multiple Peaks

•Power-meter
–Watt=Average Power
–Power threshold
•Spectrum Analyzer
–Watt/Hz=Power Density over Frequency=Frequency Domain Peak Power
–Summation of Watt/Hz of most significant frequencies resolved=Average Power
–Power frequency-spectrum mask
•Waveform Analyzer
–Watt/us=Power Density over Time=Time Domain Peak Power
–Summation of Watt/us of most significant times resolved=Average Power
–Power time-waveform mask
•2D Pattern Analyzer
–Watt/degree=Power Density over Angle=Angle Domain Peak Power
–Summation of Watt/degree of most significant angles resolved=Average Power
–Power angle-pattern mask
•3D Pattern Analyzer
–Watt/steradian=Power Density over Solid-angle =Solid-angle Domain Peak Power
–Summation of Watt/steradian of most significant solid-angles resolved=Average Power
–Power solid-angle-pattern mask
•Radiometer
–Watt/meter-square=Power Density over Unit-area=Space Domain Peak Power
–Summation of Watt/meter-square of most significant unit-areas resolved=Average Power
–Power Density threshold

RF Power Measurements of Complicated Peak

•Power-meter
–Watt=Average Power
–Power threshold
•Spectrum Analyzer
–Watt/Hz=Power Density over Frequency=Frequency Domain Peak Power
–Summation of Watt/Hz of every resolvable frequencies=Average Power
–Power frequency-spectrum mask
•Waveform Analyzer
–Watt/us=Power Density over Time=Time Domain Peak Power
–Summation of Watt/us of every resolvable times=Average Power
–Power time-waveform mask
•2D Pattern Analyzer
–Watt/degree=Power Density over Angle=Angle Domain Peak Power
–Summation of Watt/degree of every resolvable angles=Average Power
–Power angle-pattern mask
•3D Pattern Analyzer
–Watt/steradian=Power Density over Solid-angle =Solid-angle Domain Peak Power
–Summation of Watt/steradian of every resolvable solid-angles=Average Power
–Power solid-angle-pattern mask
•Radiometer
–Watt/meter-square=Power Density over Unit-area=Space Domain Peak Power
–Summation of Watt/meter-square of every resolvable unit-areas=Average Power
–Power Density threshold

地理學的科學觀、禮教觀及宗教觀

•科學觀
–說理的
•禮教觀
–規勸的
•宗教觀
–嚇阻的

無線電基地台本台風水學實務：勘查與化解

•Antenna Box (天線箱)
–Antenna (天線)
•天線無防水，凶
•天線無防水，吉
–Distance (距離)
•天線近處有阻擋，凶 (化解：加裝金屬反射板或雙層金屬反射網)
•天線近處無阻擋，吉
•天線遠近處均有阻擋，大凶
•天線遠近處均無阻擋，大吉
–Azimuth (方位)
•天線水平軸向前方有阻擋，凶 (化解：加裝金屬反射板或雙層金屬反射網)
•天線水平軸向前方無阻擋，吉
•天線水平全向均有阻擋，大凶
•天線水平全向均無阻擋，大吉
–Elevation (俯仰)
•天線垂直軸向前方有阻擋，凶 (化解：加裝金屬反射板或雙層金屬反射網)
•天線垂直軸向前方無阻擋，吉
–Right Above or Right Under (正上方或正下方)
•天線正下方處有阻擋，吉帶凶
•天線正下方處無阻擋，吉
•天線正上方處有阻擋，吉帶凶
•天線正上方處無阻擋，吉
•Transmission Line Tube (傳輸線漕)
–Transmission Line (傳輸線)
•傳輸線長，凶
•傳輸線短，吉
•Radio Equipment Chamber (無線電裝備室)
–Radio Equipment (無線電裝備)
•無線電裝備無空調，凶
•無線電裝備有空調，吉

無線電基地台鄰居風水學實務：勘查與化解

•Antenna Box (天線箱)
–Distance (距離)
•天線近處，凶 (化解：1. 加裝金屬隔離板或雙層金屬隔離網 2.加裝無毒性、防火、抗老吸收材料)
•天線遠處，吉
–Azimuth (方位)
•天線水平軸向正前方，凶 (化解：1. 加裝金屬隔離板或雙層金屬隔離網 2.加裝無毒性、防火、抗老吸收材料)
•天線水平軸向左右前方，凶多吉少 (化解：1. 加裝金屬隔離板或雙層金屬隔離網 2.加裝無毒性、防火、抗老吸收材料)
•天線水平軸向左右後方，吉多凶少
•天線水平軸向正後方，吉
–Elevation (俯仰)
•天線垂直軸向正前方，凶 (化解：1. 加裝金屬隔離板或雙層金屬隔離網 2.加裝無毒性、防火、抗老吸收材料)
•天線垂直軸向上下前方，凶多吉少 (化解：1. 加裝金屬隔離板或雙層金屬隔離網 2.加裝無毒性、防火、抗老吸收材料)
•天線垂直軸向上下後方，吉多凶少
•天線垂直軸向正後方，吉
–Right Above or Right Under (正上方或正下方)
•天線正下方處，凶多吉少 (化解：1. 加裝金屬隔離板或雙層金屬隔離網 2.加裝無毒性、防火、抗老吸收材料)
•天線正上方處，凶多吉少 (化解：1. 加裝金屬隔離板或雙層金屬隔離網 2.加裝無毒性、防火、抗老吸收材料)
•Transmission Line Tube (傳輸線漕)
–Distance (距離)
•傳輸線近處，凶多吉少 (化解：增設金屬隔離管或雙層金屬隔離套)
•傳輸線遠處，吉
•Radio Equipment Chamber (無線電裝備室)
–Distance (距離)
•無線電裝備近處，凶多吉少 (化解：增設金屬板隔離室或雙層金屬網隔離室)
•無線電裝備遠處，吉

軟體產品描述

•Architecture (建築式樣)
•Flowchart (流程圖)
•Component (元件)

The Recommended Environmental Value of Non-Ionizing Radiation

•EPA recommended environmental value is: 0.2 mW/cm2
•EPA recommended environmental value is: 833 mG

裝備與人員之環境保護

•風(Wind-Air)
•雨(Rain-Water)
•雷(Acoustic)
•電(Electric)
•磁(Magnetic)
•震(Mechanical)
•火(Thermal)
•光(Optical)
•蝕(Chemical)
•菌(Biological)
•塵(Dust)
•毒(Poison)

電路佈局風水學

•現象(電磁及電流)
–空間Air-電磁輻射或電磁感應
–電流去路Trace-電磁傳導
–電流回路Return-trace-電磁傳導
–地面電流Ground-電磁傳導
–地下電流Under-ground-電磁傳導
–電流阻絕方式-牆wall壕moat
–電流原理-電往低電壓源或電流源流、電往低阻抗負載流、電往低阻抗傳輸線流
•模型一(風水) 電磁輻射或電磁感應-風; 電磁傳導-水
–空間-風或水氣
–淨水流-水道、水管
–污水流-陰溝、陽溝
–地面水流-水池
–地下水流-水庫
–水流阻絕方式-隄防dike疏洪道floodway
–水流原理-水往低處流、水往開處流、水往直處流
•模型二(人車) 電磁輻射或電磁感應-人; 電磁傳導-車
–空間-人或車客
–往車流-平面車道、地下車道、高架車道
–返車流-平面車道、地下車道、高架車道
–地面車流-地面停車場
–地下車流-地下停車場
–車流阻絕方式-牆wall壕moat
–車流原理-車走順路、車走通路、車走近路

磁通密度

•瑞典標準<2mGuass
•紐西蘭國家輻射實驗室標準<100mGuass
•地磁=400~600mGuass
•核磁共振=5,000~25,000Guass
•發電廠=266mGuass@1m
•手機=700~2,000mGuass@1m
•微波爐=750~2,000mGuass@1m
•檯燈=400~4,000mGuass@1m
•吸塵器=2,000~8,000mGuass@1m

Notes

•The values may be exceeded provided average whole-body SAR<0.4W/kg, and peak spatial SAR<8W/kg averaged over 1g tissue
•The Academy of Medical Science of the USSR specifies 0.01mW/cm2 as a level for continuous exposure

The Recommended Environmental Value of Non-Ionizing Radiation

•EPA - Air No 3219 proclamation, 2001. 1.12.
•EPA recommended environmental value is: 0.2 mW/cm2
•EPA recommended environmental value is: 833 mG

RF Power Measurements of Simple Peak

•Power-meter
–Watt=Average Power
–Power threshold
•Spectrum Analyzer
–Watt/Hz=Power Density over Frequency=Frequency Domain Peak Power
–Watt/Hz*Mainlobe-width=Average Power
–Power frequency-spectrum mask
•Waveform Analyzer
–Watt/us=Power Density over Time=Time Domain Peak Power
–Watt/us*Pulse-width=Average Power
–Power time-waveform mask
•2D Pattern Analyzer
–Watt/degree=Power Density over Angle=Angle Domain Peak Power
–Watt/degree*Beam-width=Average Power
–Power angle-pattern mask
•3D Pattern Analyzer
–Watt/steradian=Power Density over Solid-angle =Solid-angle Domain Peak Power
–Watt/steradian*Solid-beam-cover=Average Power
–Power solid-angle-pattern mask
•Radiometer
–Watt/meter-square=Power Density over Unit-area=Space Domain Peak Power
–Watt/meter-square*Aperture-size=Average Power
–Power Density threshold

雷電風水學

•雷電 Lightning
–雷擊危險 Lightning Hazard
•高壓電塔 High-voltage Tower
–高壓電擊危險 High-voltage Conductive Hazard、磁場感應危險 Magnetic-field Reactive Hazard
•高壓線 High-voltage Transmission Lines
–高壓電擊危險 High-voltage Conductive Hazard、磁場感應危險 Magnetic-field Reactive Hazard
•變電所 Transformer Station
–磁場感應危險 Magnetic-field Reactive Hazard
•變壓器 Transformer
–磁場感應危險 Magnetic-field Reactive Hazard
•無線電基地台 Wireless Base Station
–電磁波輻射危險 Electromagnetic-wave Radiating Hazard
•廣播電台 Broadcast Base Station
–電磁波輻射危險 Electromagnetic-wave Radiating Hazard
•雷達站 Radar Site
–電磁波輻射危險 Electromagnetic-wave Radiating Hazard
•導航站 Navigation Site
–電磁波輻射危險 Electromagnetic-wave Radiating Hazard

IEEE802 Five Criteria of Project Authorization Request

•Broad Market Potential (市場商機)
•Compatibility (相容性)
•Distinct Identity (相異性)
•Technical Feasibility (技術可行性)
•Economic Feasibility (經濟可行性)

電子偵測

•Passive (黑夜找燈火)
•Semi-passive (白晝找人煙)
•active (礦工藉頭盔燈找礦物)
•semi-active (警衛藉手電筒找動靜)

Smart or Feature

•Smart Phone
–Multiple Features (Phone with Cellular, Camera, BT, PDA, GPS, WiFi, MDTV, and Multimedia)
–Combo Module
–Multi-band Antenna
–Low volume
–High cost
–High power consumption
–Average performance
–Hard to use
•Feature Phone
–Single Feature (Cellular-Phone, Camera-Phone, BT-Phone, PDA-Phone, GPS-Phone, WiFi-Phone, MDTV-Phone, or Multimedia-Phone)
–Simple Module
–Single-band Antenna
–High volume
–Low cost
–Low power consumption
–Professional performance
–Easy to use

信號處理

•類比/敏感的/實數線/連續軌跡/似氣態分子能量的/化學的/頻域
•數位/聰明的/有理數線/離散軌跡/似原子能階的/物理的/時域
•渾沌/智慧的/複數面/無軌跡/似固態能帶的/生物的/碼域

SiP Combo Modules for Wireless RFID Reader

•RFID plus ZigBee (WPAN)
•RFID plus WiFi (WLAN)
•RFID plus WiMAX (WMAN)

Antenna key Specifications

•Access-Point/ Router: VSWR
•Bridge/ Gateway: Gain
•Desktop-PC/ Laptop-PC/ Ultra-Mobile-PC: Diversity (Position, Angle, Polarization)
•Smart-Phone/ Personal-Digital-Assistant: Pattern, Isolation
•Digital-Frame/ Personal-Media-Player: VSWR
•Digital-Camera: Pattern
•PCMCIA-Card/ USB-Dongle-Adapter/ SDIO-Card: VSWR

電路發展策略

•Differentiated (差異化) vs. Standardized (標準化)
•Integrated (積體化) vs. Discrete (離散化)
•Miniaturized (縮裝化) vs. Modulized (模組化)

微波電路與電子電路

•Geometrical (幾何的) vs. Topological (拓樸的)
•Distributed (分佈的) vs. Lumped (集總的)
•Graphic (圖形的) vs. Schematic (線路的)
•High-frequency (高頻) vs. Low-frequency (低頻)
•Large-size substrate (大尺寸基板) vs. Small-size substrate (小尺寸基板)

Why SiP Combo Module of GPS plus DVB plus optional Bluetooth

•Both for outdoor applications
•Both for mobile applications
•Both for handheld applications
•Both for vehicular applications
•Both for the applications to the systems shared a common LED
•Both for the applications to the systems shared a common speaker or earphone via Bluetooth

Development Strategies

•Proprietary vs. Standard
•Non-interoperable vs. Interoperable
•Self-undertaking or Independent development vs. Joint-development
•Optional vs. Mandatory

SoB Module and SiP Module

•PCB Module for PC:
–High-throughput-WiFi
–Mobile-WiMAX
–3GPP
–UWB
•SiP Module for Phone:
–WiFi
–Bluetooth
–GPS
–MDTV

SiP Module Requirements for Phones and Non-phones

•Power Saving
–Standard or Proprietary Schemes (Both)
–Embedded 32KHz XOSC (Non-phone)
•Bluetooth Coexistence
–802.15.2 (Phone)
–Single Antenna (VoIP Phone)
•Cellular Coexistence
–Embedded GSM/3GPP Filter (Phone)
•Security
–802.11i (Both)
•Quality of Service
–802.11e (Either)
–APSD (VoIP Phone)
•High Throughput
– 802.11n (Video-Stream Phone and Non-phone)

MIMO Test Methodology

•Engineering Tests
–Using wired multiple VSAs with separated signals to test wired TX of DUT
– Using wired multiple VSGs with separated signals to test wired RX of DUT
–Using wired combo VSA/VSG plus channel emulator with matrix signals to test wired uplink/downlink system of DUT
•Manufacturing Tests
–Using wired single proprietary SA with composite signal to test wired TX of DUT
–Using wired single proprietary SG with split signal to test wired RX of DUT
–Using wireless golden device plus real but controllable environment to test wireless uplink/downlink system of DUT

Transmit-Beamforming MIMO

•Transmit beamforming
–Basic requirement for transmit beamforming: channel state information (CSI)
–The benefit of transmit beamforming is most pronounced if the number of transmit antennas is larger than the receive antennas, when multiple spatial streams are being transmitted

STBC MIMO

•Space time block coding with direct map
–Transmit antenna number is equal to the number of space-time streams
–Utilize identity mapping matrix, i.e. each space-time stream maps to one transmit antenna
•Space time block coding with spatial spreading
–The number of space-time streams is less than the number of transmit antennas
–Utilize typical Walsh matrix as well as basic MIMO does
–Utilize cyclic delay as well as basic MIMO does

Basic MIMO

•Basic MIMO with direct map
–Transmit antenna number is equal to the number of spatial streams
–Utilize identity mapping matrix, i.e. each spatial stream maps to one transmit antenna
•Basic MIMO with spatial spreading
–The number of spatial streams is less than the number of transmit antennas
–Utilize unitary spatial spreading matrix, or typical Walsh matrix
–Utilize cyclic delay diversity (CDD) to improve the performance of transmit diversity; when linearly increasing cyclic delays are applied to the antennas, time-domain cyclic delays can further mitigate undesired beamforming effects

Schemes to Achieve High MAC Data-rate (Throughput and Overall System Performance)

•Aggregation
•Bi-directional data flow
•Enhanced block acknowledgement
•Channel management (including a receiver assisted channel training protocol)
•Feedback mechanisms that enable rate adaptation

Schemes to Achieve High PHY Data-rate

•MIMO/OFDM with spatial division multiplexing of spatial streams
•Wider bandwidth
•Optimized interleaver for channelizations of different bandwidth
•Advanced FEC coding techniques, i.e. low density parity check (LDPC)
•Space time block coding (STBC)
•Transmit beamforming

Orthogonality Condition of Spatial Multiplexing

•Spatial Multiplexing is the main function of MIMO system. The spatial multiplexing gain that relates to throughput enhancement depends on orthogonality condition of MIMO antennas.
•In LOS or non-scattering MIMO environment or outdoor area, orthogonality condition is St x Sr/R>= l/M, where St and Sr are transmit and receive antenna spacings respectively, R is the range from transmit antennas to receive antennas, M is the number of receive antennas, the transmit antenna number N is not used in this condition.
•In NLOS or scattering MIMO environment or indoor area, orthogonality condition is [2 x Dt/(N-1)] x [2 x Dr/(M-1)]>=R x l/M, where Dt and Dr are transmit and receive scattering radii respectively, R is the range from transmit scattering center to receive scattering center, N and M are the numbers of transmit and receive antennas respectively.
–The scattering is made by scatterers in MIMO environment, which can be modeled by omni-directional ideal reflectors.
–The scatterers are assumed to be located sufficiently far from antennas for holding plane-wave assumption and further assumed such that Dt (or Dr) is much less than R for meeting local scattering condition.

Correlation Coefficient of Antenna Diversity

•Correlation Coefficient r = exp [-0.0021 x S x f x sqrt (0.4 x R)] by CCIR (now ITU-R), where
–S: antenna vertical spacing in m
–f: frequency in GHz
–R: range in Km

Antennas and Incoming Multipath Waves

•If the incoming multipath wave distribution in space is not wide-dispersive, then Correlation Coefficient r could not get benefit from the differentiation in antenna positions (or the separation in space)
•If the incoming multipath wave distribution in angle is not isotropic, then Correlation Coefficient r could not get benefit from the differentiation in antenna patterns (or the separation in angle)

Diversity and Multiplexing of MIMO

•In general, the greater the space separation the less the correlation coefficient and so the better the Multiplexing or Diversity, if it will not generate side-effect like differential propagation loss
–Antenna space separations of multiplexing and diversity antenna structures have the order of multiple wavelengths
•The greater the angle separation the less the correlation coefficient and so the better the multiplexing or diversity as well, if it will not generate side-effect like blocking
–Antenna angle separations of multiplexing and diversity antenna structures have the order of multiple beamwidths, or
–Antenna pattern differentiations of multiplexing and diversity antenna structures have orthogonality or well compensation between each other, e.i. null-patterns relative to peak-patterns (and furthermore, cross-polarizations relative to co-polarizations)

Diversity and Multiplexing Gains

•Diversity Gain = (Ideal Diversity Gain) x SQRT(1 – r), where the Ideal Diversity Gain is proportional to the dimensions n, m or n x m (m for Transmit diversity gain, n for receive diversity gain, n x m for total system diversity gain), Correlation Coefficient r is a function of
1.Separable Antenna Patterns (angular separation)
2.Separable Antenna Positions (spatial separation)
3.Isotropic distribution of incoming multipath waves (angular spread)
4.Wide-dispersive distribution of incoming multipath waves (delay spread)
•Multiplexing Gain is related to Correlation Coefficient r as well, except that the Ideal Multiplexing Gain is rather proportional to the dimension either m or n, whichever is less in the system

Beamforming of Smart Antenna

* The span of antenna spacings (or squint-angles) should be adjusted and traded off to get the balance between accuracy and ambiguity of direction finding by phase-comparison (or amplitude-comparison)
–Antenna spacings of phased-array beamforming antenna structure have the order of fraction wavelengths, otherwise they will generate side-effect like ambiguity due to grating lobes. Note that spacing is defined as the space separation of antenna elements
–Antenna squint-angles of amplitude-array beamforming antenna structure similarly have the order of fraction beamwidths, otherwise it will generate side-effect like ambiguity due to side lobes. Note that squint-angle is defined as half of the angle separation of antenna elements.

Beamforming Gain

•Beamforming Gain, i.e. Phase-comparison (or Amplitude-comparison) Array Gain is proportional to the Ideal Beamforming Gain which is related to the dimensions n, m or n x m (m for transmit beamforming gain, n for receive beamforming gain, n x m for total system beamforming gain), and conditionally related to the Correlation Coefficient r
-In some cases of LOS and so forth, the space distribution of incoming multipath waves is limited and fixed in path rather than wide-dispersive or of opportunity in time, so the individual antennas had better have in-phase waveforms to raise the combined gain
-In the same cases, the angle distribution of incoming multipath waves is limited and fixed in direction rather than isotropic or of opportunity in angle, so the individual antennas had better have identical patterns to raise the combined gain

Normalized total field of Phased-Array with Butler-Matrix

•Normalized total field of phased array with beams formed by Butler Matrix, i.e.
–Em(r) = {sin(N/2)[(2pd/l)sinr- (2m+1)](p/N)]} / Nsin(1/2)[(2pd/l)sinr- (2m+1)](p/N)], if elevation n = 0, where r = azimuth and m = the serial no. of the beam

Normalized total field of Phased-Array

•Define Array factor f(y) = Normalized total field En(y) = E(y)/Emax, where Emax= N, if y=0, e.i.
–f(y) = (1/N)sin(Ny/2) / sin(y/2);
•Define Array factor f(f,q) = Normalized total field En(f,q) = E(f,q)/Emax, where Emax= N if q= f= p/2, e.i.
–f(f,q) = {sin[(pd/l)Ncosfsinq] / Nsin[(pd/l)cosfsinq], or
–f(f) = {sin[(pd/l)Ncosf] / Nsin[(pd/l)cosf], if q= p/2;
•Define Array factor f(n,r) = Normalized total field En(n,r) = E(n,r)/Emax, where Emax= N if elevation n= (p/2)- q= (p/2)- p/2= 0 and azimuth r= (p/2)- f= (p/2)- p/2= 0, e.i.
–f(n,r) = {sin[(pd/l)Ncosnsinr] / Nsin[(pd/l)cosnsinr], or
–f(r) = {sin[(pd/l)Nsinr] / Nsin[(pd/l)sinr], if n= 0.
•Normalized total field or array factor determine DOA, Direction of Arrival, in general,
–r at any n (or f at any q), or specifically
–r at n= 0 (or f at q= p/2)

Total field of Phased-Array

•Total field = E(y), where phase difference y=(2pd/l)cosfsinq, e.i.
–E(y) = 1+ exp(jy)+ exp(j2y)+ exp(j3y)+ exp(j4y)+ exp(j5y)+ …+ exp[j(N-1)y]
–= [1- exp(jNy)]/ [1- exp(jy)]
–= [exp(jNy/2)/ exp(jy/2)]/ {[exp(jNy/2)- exp(-jNy/2)]/ [exp(jy/2)- exp(-jy/2)]
–= exp[j(N-1)y/2][sin(Ny/2)/ sin(y/2)], refer to the first element, or
–= sin(Ny/2)/ sin(y/2), refer to the center element

Cellular Coexistence with WiFi

•WiFi Side
–Add-on filter to block the spurs of cellular bands (GSM/3GPP) to have WiFi RX immune from interference
–Add-on filter to reject WiFi out-of-band spurs coming from WiFi TX in compliance with the requirement of regulation
•Cellular Side
–Add-on filter to block the spurs of WiFi bands to have cellular RX immune from interference
–Add-on filter to reject cellular out-of-band spurs coming from cellular TX in compliance with the requirement of regulation

IO Interface trend

•From Parallel Bus Move to Serial Bus
•Use Serial IO Interface of
–PCI express (for High-Throughput WiFi)
–USB (for WiFi and WiMAX)
–SDIO (for Low-Throughput WiFi)

Bluetooth Coexistence Schemes of WiFi

•1-wire handshake
–input: BT_ACTIVE
•2-wire handshakes
–input: BT_PRIORITY
–output: WL_ACTIVE
•3-wire handshakes
–input: BT_REQUEST, BT_STATE
–output: BT_GRANTn
•4-wire handshakes
–input: BT_REQUEST, BT_STATE, BT_FREQ
–output: BT_GRANTn

Manufacturing Test Support Equipment

•Mobile-WiMAX 16e Testing
–LitePoint: IQmax/ IQsignal
–Agilent: MXA/ MXG
•WiFi 11n Testing
–LitePoint: IQflex/ IQfact
–Agilent: WTM with Adapter

Capabilities of Production Supports

•MVT test supports of HVM production with regards to plan, equipment, tool and fixture
•Supports to incoming, in-process and outgoing quality-tests
•Supports to corrective analyses and actions
•Supports to solve the issues of DPM
•Packaging, assembling and integration technical supports

Dipole and Patch Arrays

•Vertically Linear Dipole Array
–High-gain Omni-directional Antenna
•Vertically Linear Dipole Array with back-plane
–Sectored Antenna
•Vertically Linear Patch Array
–High-gain Sectored Antenna
•Two-dimension Dipole Array with back-plane
–Directional Antenna
•Two-dimension Patch Array
–High-gain Directional Antenna

11n Multi-Radio Reality

•2T2R AP (Personal Router) + 1T1R STA (Handheld)
–Uplink: SIMO/ Downlink: MISO
•2T2R AP + 1T2R STA (LE PC Card or Handheld)
–Uplink: SIMO/ Downlink: MIMO
•2T2R AP + 2T2R STA (ME PC Card)
–Uplink: MIMO/ Downlink: MIMO
•2T2R AP + 2T3R STA (HE PC Card)
–Uplink: MIMO/ Downlink: MIMO
•2T3R AP (Home Gateway) + 1T1R STA
–Uplink: SIMO/ Downlink: MISO
•2T3R AP + 1T2R STA
–Uplink: SIMO/ Downlink: MIMO
•2T3R AP + 2T2R STA
–Uplink: MIMO/ Downlink: MIMO
•2T3R AP + 2T3R STA
–Uplink: MIMO/ Downlink: MIMO
•3T3R AP (Enterprise AP) + 1T1R STA
–Uplink: SIMO/ Downlink: MISO
•3T3R AP + 1T2R STA
–Uplink: SIMO/ Downlink: MIMO
•3T3R AP + 2T2R STA
–Uplink: MIMO/ Downlink: MIMO
•3T3R AP + 2T3R STA
–Uplink: MIMO/ Downlink: MIMO

The elements of Minder-line Monopole Antenna

•Radiator
•Feed
•Short
•Reflector
•Parasitic Object
•Dielectric Material
•Radome

Minder-line Monopole Antenna

•Single-band versus multi-band
•Single-feed versus multi-feed
•Organic dielectric versus LTCC dielectric
•Printed versus Chip-surface-mounted

SiP Layout Tools

•RF:
–Cadence Virtuoso (SiP RF Architect, SiP RF Layout) and 3rd party SiP RF SI
•Digital:
–Cadence Encounter (SiP Digital Architect, SiP Digital Layout and SiP Digital SI)
•Hybrid:
–Cadence Precision Router

SKU Control

•Specific
•Universal
•Most of World
•Rest of World

The easiness of driver porting

•Does the Chipset solution provide version-finalized drivers (which, usually, support popular OS as Linux, Windows-CE or Windows-Mobile, support popular CPU as Samsung S3C, Intel/Marvell PXA or Qualcomm MSM and/or support popular commercial developing systems) with source codes for easily evaluating and driver porting to other drivers?
•Does the Chipset solution provide base-line driver with source code, which has OS and CPU agnostic driver architecture for easily evaluating and driver porting to other drivers?

Full-Scale-Development

•Business-Developing
–Phase-in/ Evaluation/ Program-Planning
•Engineering
–Analysis/ Simulation/ Testing
–Reference-Design/ Design-in/ Design-Review
•Trial
–Quality-Test/ Reliability-Test
–Demonstration/ Bench-Mark
–Certification/ Validation
•Manufacturing
–Calibration/ Verification
•Service
–Grooming/ Installation/ Integration/ Training/ Logistic Support/ Upgrade/ Phase-out

Form-Factor versus Profile

•Form-Factor or Profile?
–Low Profile
–Small Form-Factor
–Low Profile and Small Form-Factor
•Applications?
–Personal Digital Assistant
–Feature Phone
–Smart Phone
–All of the above

The Elements of Inverted-F Antenna

•Radiator
•Feed
•Short
•Reflector
•Parasitic Object
•Dielectric Material
•Radome

Multiple Radios

*Concurrent multiple Radios of 802.11abg:
-Performance depends on Isolation among different antennas
*MIMO multiple Radios of 802.11n:
-Performance depends on Correlation and Isolation among different antennas

RF Testing

•Test Facilities
–Network-Analyzer/ Waveform-Oscilloscope/ Spectrum-Analyzer/ Signal-Generator/ Signal-Analyzer/ Power-Analyzer
•Test Items
–Function Tests for Transmitter/ Receiver/ Process and Control
–Performance Tests for Signal-Quality/ Link-Quality/ Quality-of-Service
–Compliance Tests for ESD/ SAR/ EMC

RF Simulation

•Specification, Design and Application
–RF Pre-selection and RFI Filters
–Low-Noise and Power Amplifiers
•Characterization, Modeling and Optimization
–Passive and Active Networks
–Small-signal and Large-signal Networks

RF Analysis

•Link Budgets (Gain/ Phase-Shift/ Error/ Noise-Figure)
•Cross Interference among occupied bands and among operating channels
•PCB Stack-up and Impedance Control
•PCBA Layout and EMI/SI/PI Control
•Current-Consumption and Power-Management
•Heat-Dissipation and Thermal-Control
•Software Readiness (Utility/ Driver)
•Component Characteristics
•BOM Cost and Material Delivery Time

Propagation Testing

•Test Facilities
–Channel-sounding
•Specific or typical clear test ranges
•Channel-sounder or the equivalent (VNA plus IFFT tool, for example.)
•Channel-Emulator
–Site-surveying
•Specific or typical real test ranges
•Golden Sample or the equivalent (VSA or any other types of monitor)
•Electromagnetic-Environment-Simulator
•Test Items
–Channel-sounding
•Mean Path Loss, Shadow Fading Loss, Angle Spread, Delay Spread, Doppler Spread
–Site-surveying
•Signal Strength, Packet-Error-Rate, Throughput, Packet-loss, Latency, Jitter

Propagation Simulation

•Ray-tracing method
•Finite-difference time-domain method
•Statistical method

Propagation Analysis

•6 delay profile models and analyses
–Model A for zero delay spread
–Models B/C/D/E/F for non-zero delay spread
•Path loss model and analysis
•Shadow fading probability distribution and analysis
•MIMO models and analyses
–Fixed (Constant, LOS) Matrix
–Rayleigh Matrix

Power Saving Technologies

•Power Efficiency
–Use versatile PMU, Power Management Unit
–Use efficient and power manageable PA, Power Amplifier
–Use efficient and power manageable CPU, Center Process Unit
•Power Management
–Add Power-down (or Sleep) mode in addition to Continuously-active mode
–Per IEEE802.11 Standard, replace Continuously-active mode by Power-saving (or Standby) mode, using PS-Polling approach
–Per IEEE802.11e Standard, replace Continuously-active mode by a more efficient Power-saving (or Standby) mode, using Scheduled or Unscheduled Automatic Power Save Delivery approach

Power Amplifier Design and Application

•Goals
–Design for Range Extension and Throughput Enhancement
•Methodologies
–Optimize the maximum output power versus EVM of PA model by changing single-tone, dual-tone and/or multi-tone (OFDM/mQAM) parameters
–Fine-tune the source/load pulling of PA prototype by adjusting tuners and signal/interference/noise generators
• Metrics
–Linearity, Bandwidth, Bias, EVM, Maximum Output Power, Power Consumption, Heat Dissipation, EMI Shielding

Design Capability

•Design Strategy:
–Reference Design
–Design-in
–Design Review
•Design Methodology:
–Formulating, Fitting and Analysis
–Modeling, Optimization and Simulation
–Prototyping, Tuning and Testing

Smart Antenna

•Antenna Array and Comparison Network
•Direction-finding
•Beam-forming
•Multi-path-effect elimination

MIMO Antenna

•Multiple Antenna
–Multiple TX/RX antenna system to match with Multiple-Input Multiple-Output propagation channel
•Antenna Diversity
–Space/Pattern/Polarization diversity for signal quality enhancement which results in range extension
•Spatial Multiplexing
–Link quality (throughput, packet-loss etc.) enhancement by the multiplexing in space domain
•Multi-path-effect elimination

Omni-directional Antenna

•Low-Gain versus High-Gain
•Indoor versus Outdoor
•Dipole versus Dipole-Array
•Metal-worked versus Printed

Directional and Sectored Antennas

•Beamwidth versus Angular Coverage
•Array versus Aperture
•Manually Adjustable Bore-sight Alignment with RSSI/TSSI LED Display versus Automatically Adjustable Bore-sight Alignment with ASIC Control

Inverted-F Antenna

•Single-band versus multi-band
•Single-feed versus multi-feed
•Metal-worked radiator versus micro-stripped radiator
•Simplified structure versus parasitic structure
•Planar versus Cubic
•Air dielectric versus Non-air dielectric

Antenna Isolation for Coexistence

•Differentiation of Antenna Center Positions
–Wide Spacing (space-separation)
•Differentiation of Antenna Patterns
–Wide Squint-angle (angle-separation)
•Differentiation of Antenna Polarizations
–Orthogonal Relative-Polarization (polarization-differentiation)

Weather Proof

•Use Sealed Enclosure
–Designs of International Protection Class Rating (68 is the highest Class) against Dust and Water
•Use Un-sealed Housing
–Design by using Coated PCBA
–Design by using Coated, Sealed or Corrosion-protected components
–Design by using Ventilated Housing

Outdoor Antenna

•Weather Proof
•High Gain Omni-Directional Antenna
–1D Dipole Array Strip Panel
•High Gain Sectored Antenna
–1D Patch Array Strip Panel
•High Gain Directional Antenna
–2D Patch Array Rectangular Panel

Antenna Testing

•Vector Network Analyzer
–Return Loss and Isolation Tests
•Shielded Anechoic Chambers with 2D or 3D Tester
–Radiating Pattern and Power Gain Tests

Antenna Simulation

•2.5D (IE3D) and 3D (HFSS) Simulations
•Achieve high resemblances of Return Loss, Radiation Pattern, Isolation and Power Gain between predictions and measurements

Antenna Analysis

•Polarization
•Polarization Difference
•Pattern
•Pattern Difference
•Phase-center
•Spacing
•Bore-sight
•Squint Angle

Antenna System

•Antenna Array
–Amplitude or Phase comparison Array (Directivity)
–Beamforming (Steering)
•Multiple Antennas
–Diversity (Range)
–Multiplexing (Throughput)
•Antenna and RF Front-end Integration
–Antennas plus Transformers (Efficiency)
–Antennas plus Filters (Out-of-band Isolation)
–Antennas plus Switches (In-band Isolation)
–Antennas plus Beamformers (Cost-effectiveness)
–Antennas plus Couplers (Concurrency)

Embedded Antenna Design

•Dipole
•Monopole
•Meander-line Monopole
•Patch
•Reduced-size Patch
•Inverted-F
•Antenna System

Embedded Antenna

•Chip Antenna
•Metallic Antenna
•PCB (Printed Circuit Board) Antenna
•FPC (Flexible Printed Circuit) Antenna

Service Capability of SiP module provider

•Customer-Oriented Supports
–Qualify the customer satisfaction by means of emotional value in addition to functional value
•Technical Supports
–Antenna Installation and Testing Pre-services
–System Integration and Field-trial pre-services
•Application Engineering Supports
–Localization
•Logistic Supports
–Globalization

Electro-Magnetic Compatibility

•Regulation of EMC Emissions
–FCC in the United States
–IC in Canada
–ETSI in Europe
–TELEC in Japan
•Specific Absorption Rate
•Electro-Static Discharge

CAE/CAD/CAM for SiP module

•Computer Aided Engineering
–In-module RF printed-circuit modeling and simulation
–In-module signal-integrity, power-integrity and electro-magnetic-interference modeling and simulation
–In-module thermal modeling and simulation
–In-module mechanical modeling and simulation
•Computer Aided Design
–Module layout and routing
•Computer Aided Manufacturing
–Module array layout for the convenience and economy of PCB fabrication and PCBA assembling

Concurrent Engineering of SiP Module: Design for Excellence

-Design For Quality
-Design For Manufacturability
-Design For Testability
-Design For Service
-Design For Cost

SDIO architecture regarding WiFi SiP module

•Refer to Bsquare’s and Atheros’ presentations:
–Application Program (LLC, DHCP, TCPIP, Configuration Utility, etc.)
–Application Program Interface (WMI, Atheros’ Wireless Module Interface or RNDIS, Microsoft’s Remote Network Driver Interface Specification)
–SDIO Client Driver
–Client Driver Interface
–Bus Driver
–Host Controller Driver Interface
–Host Controller Driver
–Local Bus Interface
–Host Controller
–Electrical Interface
–SDIO WLAN Module Firmware (MAC, PHY)

Manufacturing-verification-test control for SiP module

•Manual
•Semi-automatic
•Automatic (sequence)
•Automatic (time-sharing)
•Automatic (batch)

System-in-Package Comparing with System-on-Chip

•SiP Needs shorter lead time and lower cost to develop wireless system.
•SiP may be the only solution to implement a wireless system into a single package. It’s difficult to integrate RF Frontend onto single chip.

Power management of WiFi SiP module

•802.11 power-save mechanisms
•Automatic-power-save-delivery is an enhancement of the existing 802.11 power save mechanisms
•Clock control power-save mechanisms
–Low-level Clock/ Low-frequency Clock/ Clock Gate-off/ Clock Disable
•Others

Antenna port number of SiP Module

•SiP module being embedded in a regular-size and portable system:
–To setup two antenna ports for the application to antenna diversity is feasible but is not encouraged to system-makers for cost-down consideration
•SiP module being embedded in a miniature-size and mobile system:
–To setup one antenna port for the application to single antenna is usually suggested to system-makers
–A moving device or a device held by an unstable human hand can provide pseudo diversity mechanism in space

SiP Module Packing

•Tray
•Tape and Reel
•Tube

The Package methods of SiP module

•Over-mounted metallic lid as a EMI shield
•Over and/or under-molded plastics as a ESD or intruder shield

The types of SiP Module footprints

•By the shapes of soldering points
–Land Patterns
–Ball Patterns
•By the configurations of soldering points
–Lines
•Dual-in-line
•Irregular or Asymmetrical Lines (minimal requirement of balance in structure is needed)
–Perimeter
•Single Row Perimeter
•Double Row Perimeter
•Irregular or Asymmetrical Perimeter (minimal requirement of balance in structure is needed)
–Array
•Grid Array
•Irregular or Asymmetrical Arrays (minimal requirement of balance in structure is needed)

The types of SiP chip packaging

•Single-side-mount
•Double-side-mount
–With cavity on bottom side
–Without cavity on bottom side
•Stacked-mount
–Package-on-Package (Ball)
–Chip-on-Chip (Wire)
–Wafer-Level-Package (Si-Thru-Via)

Chip mounting technologies for SiP module

•Flip-Chip-on-Board
•Wire-bounded-Chip-on-Board

Communication Protocols used to in-system program the EEPROM in SiP Module

•IIC™ (Inter Integrated Circuit)
–2-wire
•MW™ (Micro Wire)
–3-wire
•SPI™ (Serial Peripheral Interface)
–4-wire

Certification of SiP module by handheld-maker?

•Yes, handheld-maker should do the duty for making certification of FCC/ETSI etc.
•There is almost no way to have SiP-module provider do the certification for compliance with EMC/SAR regulation even if the SiP module has its own EMI shield
•Further, it is hard to keep SiP module far away from other devices or components on the system board of handheld
•So, system-level certification is always needed; and pre-scan for certification by module provider is certainly welcomed by any system makers

Pin-to-pin backward compatibility to Legacy Models of SiP module

•Trade the cost-effectiveness of changing and not changing the pin-count and pin-out after SiP schematic and/or its layout have upgraded
•The cost includes the re-layout and subsequent re-certification cost-up of system maker who uses that SiP module
•The effectiveness includes any of effectiveness-up of system maker who uses that SiP module, which are due to possible pin-count reduction, pin-out optimization, and the results in form-factor decreasing and easiness of trace/ground routing for either EMI immunity or RF performance enhancement

Form-factors and Profiles of SiP Modules of WiFi-Only or WiFi/Bluetooth-Combo

•SiP circuitry only
–Occupied area: 100~200mm^2
–Thickness: 1~2mm
•Both SiP and out-of-package circuitry
–Percentage occupied area of SiP module with rest out-of-package components, relative to the occupied area of the circuitry by Direct-Chip-Attachment: ~50%
–Percentage thickness of SiP module with rest out-of-package components, relative to the occupied area of the circuitry by Direct-Chip-Attachment: ~100%

SiP Module: Design-guide versus Assembling-guide

•Let manufacturing be dominated by a leading EMS assembling house:
–The assembling house issues his design-guide which reflects his capability of manufacturing to each contracted design house of his
•Let manufacturing be dominated by a leading EDS design house:
–The design house issues his assembling-guide which matches his design goal to all his contracted assembling houses

An issue of WiFi+Flash SiP Combo module

•A SDIO WiFi shares common electrical interfaces with those of a SD flash memory
–A duplex-switch or a wired-OR are utilized for connecting
•A SDIO WiFi uses separated electrical interfaces from those of SD flash memory
–Flexibility is given for the easiness of controls and communications by respective drivers

An issue of WiFi+Bluetooth SiP Combo module

•A WiFi shares common antenna with that of a Bluetooth
–A duplex-switch or a power-divider are utilized for connecting
•A WiFi uses separated antenna from that of a Bluetooth
–Flexibility is given for the easiness of coexistence and EMC between WiFi and Bluetooth

The substrate building/providing for SiP Module making

Who are the best SiP substrate builders and providers in the world?

The packaging and the testing for SiP Modules

Who are the ones of the best assembling houses in the world for SiP Module packaging and testing on the stages of either sample run, pre-production run or production run?

Out-sourcing for SiP Module assembling

•RFI and Information:
–Qualification of Sample-run and Production-run (including Engineering-capability, Manufacturing-capacity, Technology and Management) Surveying
•RFP and Proposal:
–Primary-Item-Development-Specifications Negotiation
•RFQ and Quotation:
–Statement-Of-Works Deal-making

The third Parties of SiP Module Provider

•Chipset Vendors
•Rest Component Providers
•Mechanical Part Providers
•Test Support Equipment and Test Fixture Providers
•Certification Test Houses
•Assembling (Packaging/Testing) Houses

Manufacturing Verification Tests regarding SiP module

•In SiP Module provider side, the MVT test items include:
–Mandatory TX calibration and test
–Mandatory RX test
–Mandatory Memory loading and verification
–Optional Link throughput test
•In system maker side, who uses SiP Module, the MVT test items include:
–Optional TX test (without TX calibration or with TX calibration by default setting)
–Optional RX test
–Optional Memory verification (without Memory loading or with Memory loading by default setting)
–Mandatory Link throughput test

Tests prepared for SiP module provider

•Engineering Verification Tests (for the Quality/Reliability Assurances on Development Stage)
•Design Verification Tests including Contract-Specification, Certification, Regulation, Safety and Environment Tests (for the Quality/Reliability Assurances on Design Stage)
•Manufacturing Verification Tests including Low/middle/high-volume input/in-process/output tests (for the Quality/Reliability Assurance on Production Stage)

Tests propared for system maker who uses SiP module

•Optional assembling go-no-go diagnose by proprietary diagnostic tool (usually developed by SiP Module provider under supporting by chipset vender)
•Optional RF function/performance test by proprietary test tool (usually developed by chipset vender)
•Mandatory System function/performance check, simplified or complicated, by test utility over real platform (usually developed by system maker under supporting by SiP Module provider)

Possible elements in SiP In-package Front-end Module

•Power Amplifier
•Low Noise Amplifier
•Filters
•TX/RX Switch
•Bluetooth/WiFi Switch or Power Divider (Optional)
•Antenna Diversity Switch (Optional)

SiP possible integrated passive technologies

•Thin-film
•Low-temperature co-fired ceramic (LTCC)
•High-density interconnection (HDI)

Bluetooth Coexistence Consideration regarding SiP Module

•Time sharing by 1/2/3/4-wire handshake
•Adaptive frequency hopping (BT1.2 and its descendants)
•Electromagnetic compatibility in Antenna and RF circuitry

Feature of In-Package Memory of SiP Module

•Flash Memory
–Low-cost, high-density, high-speed architecture; low power; high reliability
•EEPROM (Electrically Erasable Programmable Read-Only Memory)
–Electrically byte-erasable; lower reliability, higher cost, lowest density

The substrate of SiP module

Material:
- Organic (High-Tg FR4/BT, Low-cost)
- Ceramic (LTCC, Small-form-factor)
Stackup:
- Laminate (Low-cost)
- Buildup (Small-form-factor)

SKU selections and RF Feature options of SiP modules

SKU (Stock Keeping Unit) selections:
1) Package: BGA or QFN
2) Power inputs: 3.3V single voltage or 3.3/1.8V dual voltages
3) Interface: SDIO single mode or Localbus/SDIO dual modes
4) 32.768kHz Oscillator: internal or external
5) Standard: WiFi only or WiFi/Bluetooth Combo
RF Feature options:
1) In-package Filters for GSM/3GPP Coexistence
2) In-package Shield for EMI immunity

SiP Driver porting supports

The Operating Systems supported by Drivers:
1) Windows CE
2) Windows Mobile
3) Linux
4) ThreadX
5) uC-Linux
6) uC-OS2
7) uItron
8) OS2
9) Nucleus
10)Symbian

Capability of SiP module provider

1) SiP RF/hardware/mechanical designs
2) SiP software design
3) SiP packaging
4) SiP testing
5) Driver porting support to system-maker
6) Utility/application-program supports to system-maker
7) Antenna engineering support to system-maker
8) Manufacturing process/test supports to system-maker
9) Supports of providing design/application guides to system-maker
10) Supports of helping design/application reviews to system-maker
11) Supports of assisting design/application debugs to system-maker

Main Feature of WiFi SiP Module

Standard
Solution
Dimensions
Package
Host Interface
Driver support
Power supply
Rest components
TX performance @SNR25dB or EVM5.6%
RX performance @ PER10%
Throughput performance @Linux/X86
Power consumption @ TX output power15dBm
Bluetooth coexistence
GSM/3GPP coexistence

How does SiP Module differ from the scheme of DCA

Use SiP (System in Package) Module rather than the scheme of DCA (Direct-Chip-Attachment):
1) If system-maker obtains Known Good Modules from module vendor,
•he can reduce system defects-per-million
•he can reduce system test-time
2) If system-maker obtains Small Form Factor Modules with Low Profile from module vendor,
•he can reduce the occupied area of the regarding circuits without sacrificing the thickness of them

What is SiP

A complete system packaged in one housing.
A SiP contains several ICs (chips) including a microprocessor on a single substrate such as ceramic or laminate.
A SiP is really a multichip module (MCM) that contains all the parts of a complete system.
The SiP term was first used by Amkor Technology in the late 1990s and not trademarked in order to encourage its use worldwide.