SiP Module and Other Topics
Friday, April 24, 2009
線路(Circuitry)
•工法(Methodology)
–塗(Painting/ Filling)
–鍍(Plating/ Coating)
–染(Dying/ Finishing)
•技術(Technology)
–印刷(Printing)
–沉積(Deposition)
–離子佈植(Ion-Implantation)
•製程(Processing)
–厚膜(Thick-Film)
–薄膜(Thin-Film)
–半導體(Semi-conductor)
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