SiP Module and Other Topics
Thursday, October 4, 2007
Reliability Tests
•Vibration/Impact-Shock
–Acoustic/Mechanical Analysis
•Temperature/Heat-Shock
–Thermal Analysis
•Electromagnetic-Interference/ Electromagnetic-Pulse
–Electromagnetic (EM) Analysis
•Signal Integrity/Power Integrity
–Voltage-Current (VI) Analysis
No comments:
Post a Comment
‹
›
Home
View web version
No comments:
Post a Comment