•Link Budgets (Gain/ Phase-Shift/ Error/ Noise-Figure)
•Cross Interference among occupied bands and among operating channels
•PCB Stack-up and Impedance Control
•PCBA Layout and EMI/SI/PI Control
•Current-Consumption and Power-Management
•Heat-Dissipation and Thermal-Control
•Software Readiness (Utility/ Driver)
•Component Characteristics
•BOM Cost and Material Delivery Time
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