SKU Control

•Specific
•Universal
•Most of World
•Rest of World

The easiness of driver porting

•Does the Chipset solution provide version-finalized drivers (which, usually, support popular OS as Linux, Windows-CE or Windows-Mobile, support popular CPU as Samsung S3C, Intel/Marvell PXA or Qualcomm MSM and/or support popular commercial developing systems) with source codes for easily evaluating and driver porting to other drivers?
•Does the Chipset solution provide base-line driver with source code, which has OS and CPU agnostic driver architecture for easily evaluating and driver porting to other drivers?

Full-Scale-Development

•Business-Developing
–Phase-in/ Evaluation/ Program-Planning
•Engineering
–Analysis/ Simulation/ Testing
–Reference-Design/ Design-in/ Design-Review
•Trial
–Quality-Test/ Reliability-Test
–Demonstration/ Bench-Mark
–Certification/ Validation
•Manufacturing
–Calibration/ Verification
•Service
–Grooming/ Installation/ Integration/ Training/ Logistic Support/ Upgrade/ Phase-out

Form-Factor versus Profile

•Form-Factor or Profile?
–Low Profile
–Small Form-Factor
–Low Profile and Small Form-Factor
•Applications?
–Personal Digital Assistant
–Feature Phone
–Smart Phone
–All of the above

The Elements of Inverted-F Antenna

•Radiator
•Feed
•Short
•Reflector
•Parasitic Object
•Dielectric Material
•Radome

Multiple Radios

*Concurrent multiple Radios of 802.11abg:
-Performance depends on Isolation among different antennas
*MIMO multiple Radios of 802.11n:
-Performance depends on Correlation and Isolation among different antennas

RF Testing

•Test Facilities
–Network-Analyzer/ Waveform-Oscilloscope/ Spectrum-Analyzer/ Signal-Generator/ Signal-Analyzer/ Power-Analyzer
•Test Items
–Function Tests for Transmitter/ Receiver/ Process and Control
–Performance Tests for Signal-Quality/ Link-Quality/ Quality-of-Service
–Compliance Tests for ESD/ SAR/ EMC

RF Simulation

•Specification, Design and Application
–RF Pre-selection and RFI Filters
–Low-Noise and Power Amplifiers
•Characterization, Modeling and Optimization
–Passive and Active Networks
–Small-signal and Large-signal Networks

RF Analysis

•Link Budgets (Gain/ Phase-Shift/ Error/ Noise-Figure)
•Cross Interference among occupied bands and among operating channels
•PCB Stack-up and Impedance Control
•PCBA Layout and EMI/SI/PI Control
•Current-Consumption and Power-Management
•Heat-Dissipation and Thermal-Control
•Software Readiness (Utility/ Driver)
•Component Characteristics
•BOM Cost and Material Delivery Time

Propagation Testing

•Test Facilities
–Channel-sounding
•Specific or typical clear test ranges
•Channel-sounder or the equivalent (VNA plus IFFT tool, for example.)
•Channel-Emulator
–Site-surveying
•Specific or typical real test ranges
•Golden Sample or the equivalent (VSA or any other types of monitor)
•Electromagnetic-Environment-Simulator
•Test Items
–Channel-sounding
•Mean Path Loss, Shadow Fading Loss, Angle Spread, Delay Spread, Doppler Spread
–Site-surveying
•Signal Strength, Packet-Error-Rate, Throughput, Packet-loss, Latency, Jitter

Propagation Simulation

•Ray-tracing method
•Finite-difference time-domain method
•Statistical method

Propagation Analysis

•6 delay profile models and analyses
–Model A for zero delay spread
–Models B/C/D/E/F for non-zero delay spread
•Path loss model and analysis
•Shadow fading probability distribution and analysis
•MIMO models and analyses
–Fixed (Constant, LOS) Matrix
–Rayleigh Matrix

Power Saving Technologies

•Power Efficiency
–Use versatile PMU, Power Management Unit
–Use efficient and power manageable PA, Power Amplifier
–Use efficient and power manageable CPU, Center Process Unit
•Power Management
–Add Power-down (or Sleep) mode in addition to Continuously-active mode
–Per IEEE802.11 Standard, replace Continuously-active mode by Power-saving (or Standby) mode, using PS-Polling approach
–Per IEEE802.11e Standard, replace Continuously-active mode by a more efficient Power-saving (or Standby) mode, using Scheduled or Unscheduled Automatic Power Save Delivery approach

Power Amplifier Design and Application

•Goals
–Design for Range Extension and Throughput Enhancement
•Methodologies
–Optimize the maximum output power versus EVM of PA model by changing single-tone, dual-tone and/or multi-tone (OFDM/mQAM) parameters
–Fine-tune the source/load pulling of PA prototype by adjusting tuners and signal/interference/noise generators
• Metrics
–Linearity, Bandwidth, Bias, EVM, Maximum Output Power, Power Consumption, Heat Dissipation, EMI Shielding

Design Capability

•Design Strategy:
–Reference Design
–Design-in
–Design Review
•Design Methodology:
–Formulating, Fitting and Analysis
–Modeling, Optimization and Simulation
–Prototyping, Tuning and Testing

Smart Antenna

•Antenna Array and Comparison Network
•Direction-finding
•Beam-forming
•Multi-path-effect elimination

MIMO Antenna

•Multiple Antenna
–Multiple TX/RX antenna system to match with Multiple-Input Multiple-Output propagation channel
•Antenna Diversity
–Space/Pattern/Polarization diversity for signal quality enhancement which results in range extension
•Spatial Multiplexing
–Link quality (throughput, packet-loss etc.) enhancement by the multiplexing in space domain
•Multi-path-effect elimination

Omni-directional Antenna

•Low-Gain versus High-Gain
•Indoor versus Outdoor
•Dipole versus Dipole-Array
•Metal-worked versus Printed

Directional and Sectored Antennas

•Beamwidth versus Angular Coverage
•Array versus Aperture
•Manually Adjustable Bore-sight Alignment with RSSI/TSSI LED Display versus Automatically Adjustable Bore-sight Alignment with ASIC Control

Inverted-F Antenna

•Single-band versus multi-band
•Single-feed versus multi-feed
•Metal-worked radiator versus micro-stripped radiator
•Simplified structure versus parasitic structure
•Planar versus Cubic
•Air dielectric versus Non-air dielectric

Antenna Isolation for Coexistence

•Differentiation of Antenna Center Positions
–Wide Spacing (space-separation)
•Differentiation of Antenna Patterns
–Wide Squint-angle (angle-separation)
•Differentiation of Antenna Polarizations
–Orthogonal Relative-Polarization (polarization-differentiation)

Weather Proof

•Use Sealed Enclosure
–Designs of International Protection Class Rating (68 is the highest Class) against Dust and Water
•Use Un-sealed Housing
–Design by using Coated PCBA
–Design by using Coated, Sealed or Corrosion-protected components
–Design by using Ventilated Housing

Outdoor Antenna

•Weather Proof
•High Gain Omni-Directional Antenna
–1D Dipole Array Strip Panel
•High Gain Sectored Antenna
–1D Patch Array Strip Panel
•High Gain Directional Antenna
–2D Patch Array Rectangular Panel

Antenna Testing

•Vector Network Analyzer
–Return Loss and Isolation Tests
•Shielded Anechoic Chambers with 2D or 3D Tester
–Radiating Pattern and Power Gain Tests

Antenna Simulation

•2.5D (IE3D) and 3D (HFSS) Simulations
•Achieve high resemblances of Return Loss, Radiation Pattern, Isolation and Power Gain between predictions and measurements

Antenna Analysis

•Polarization
•Polarization Difference
•Pattern
•Pattern Difference
•Phase-center
•Spacing
•Bore-sight
•Squint Angle

Antenna System

•Antenna Array
–Amplitude or Phase comparison Array (Directivity)
–Beamforming (Steering)
•Multiple Antennas
–Diversity (Range)
–Multiplexing (Throughput)
•Antenna and RF Front-end Integration
–Antennas plus Transformers (Efficiency)
–Antennas plus Filters (Out-of-band Isolation)
–Antennas plus Switches (In-band Isolation)
–Antennas plus Beamformers (Cost-effectiveness)
–Antennas plus Couplers (Concurrency)

Embedded Antenna Design

•Dipole
•Monopole
•Meander-line Monopole
•Patch
•Reduced-size Patch
•Inverted-F
•Antenna System

Embedded Antenna

•Chip Antenna
•Metallic Antenna
•PCB (Printed Circuit Board) Antenna
•FPC (Flexible Printed Circuit) Antenna

Service Capability of SiP module provider

•Customer-Oriented Supports
–Qualify the customer satisfaction by means of emotional value in addition to functional value
•Technical Supports
–Antenna Installation and Testing Pre-services
–System Integration and Field-trial pre-services
•Application Engineering Supports
–Localization
•Logistic Supports
–Globalization

Electro-Magnetic Compatibility

•Regulation of EMC Emissions
–FCC in the United States
–IC in Canada
–ETSI in Europe
–TELEC in Japan
•Specific Absorption Rate
•Electro-Static Discharge

CAE/CAD/CAM for SiP module

•Computer Aided Engineering
–In-module RF printed-circuit modeling and simulation
–In-module signal-integrity, power-integrity and electro-magnetic-interference modeling and simulation
–In-module thermal modeling and simulation
–In-module mechanical modeling and simulation
•Computer Aided Design
–Module layout and routing
•Computer Aided Manufacturing
–Module array layout for the convenience and economy of PCB fabrication and PCBA assembling

Concurrent Engineering of SiP Module: Design for Excellence

-Design For Quality
-Design For Manufacturability
-Design For Testability
-Design For Service
-Design For Cost

SDIO architecture regarding WiFi SiP module

•Refer to Bsquare’s and Atheros’ presentations:
–Application Program (LLC, DHCP, TCPIP, Configuration Utility, etc.)
–Application Program Interface (WMI, Atheros’ Wireless Module Interface or RNDIS, Microsoft’s Remote Network Driver Interface Specification)
–SDIO Client Driver
–Client Driver Interface
–Bus Driver
–Host Controller Driver Interface
–Host Controller Driver
–Local Bus Interface
–Host Controller
–Electrical Interface
–SDIO WLAN Module Firmware (MAC, PHY)

Manufacturing-verification-test control for SiP module

•Manual
•Semi-automatic
•Automatic (sequence)
•Automatic (time-sharing)
•Automatic (batch)

System-in-Package Comparing with System-on-Chip

•SiP Needs shorter lead time and lower cost to develop wireless system.
•SiP may be the only solution to implement a wireless system into a single package. It’s difficult to integrate RF Frontend onto single chip.

Power management of WiFi SiP module

•802.11 power-save mechanisms
•Automatic-power-save-delivery is an enhancement of the existing 802.11 power save mechanisms
•Clock control power-save mechanisms
–Low-level Clock/ Low-frequency Clock/ Clock Gate-off/ Clock Disable
•Others

Antenna port number of SiP Module

•SiP module being embedded in a regular-size and portable system:
–To setup two antenna ports for the application to antenna diversity is feasible but is not encouraged to system-makers for cost-down consideration
•SiP module being embedded in a miniature-size and mobile system:
–To setup one antenna port for the application to single antenna is usually suggested to system-makers
–A moving device or a device held by an unstable human hand can provide pseudo diversity mechanism in space

SiP Module Packing

•Tray
•Tape and Reel
•Tube

The Package methods of SiP module

•Over-mounted metallic lid as a EMI shield
•Over and/or under-molded plastics as a ESD or intruder shield

The types of SiP Module footprints

•By the shapes of soldering points
–Land Patterns
–Ball Patterns
•By the configurations of soldering points
–Lines
•Dual-in-line
•Irregular or Asymmetrical Lines (minimal requirement of balance in structure is needed)
–Perimeter
•Single Row Perimeter
•Double Row Perimeter
•Irregular or Asymmetrical Perimeter (minimal requirement of balance in structure is needed)
–Array
•Grid Array
•Irregular or Asymmetrical Arrays (minimal requirement of balance in structure is needed)

The types of SiP chip packaging

•Single-side-mount
•Double-side-mount
–With cavity on bottom side
–Without cavity on bottom side
•Stacked-mount
–Package-on-Package (Ball)
–Chip-on-Chip (Wire)
–Wafer-Level-Package (Si-Thru-Via)

Chip mounting technologies for SiP module

•Flip-Chip-on-Board
•Wire-bounded-Chip-on-Board