A complete system packaged in one housing.
A SiP contains several ICs (chips) including a microprocessor on a single substrate such as ceramic or laminate.
A SiP is really a multichip module (MCM) that contains all the parts of a complete system.
The SiP term was first used by Amkor Technology in the late 1990s and not trademarked in order to encourage its use worldwide.
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