•SiP circuitry only
–Occupied area: 100~200mm^2
–Thickness: 1~2mm
•Both SiP and out-of-package circuitry
–Percentage occupied area of SiP module with rest out-of-package components, relative to the occupied area of the circuitry by Direct-Chip-Attachment: ~50%
–Percentage thickness of SiP module with rest out-of-package components, relative to the occupied area of the circuitry by Direct-Chip-Attachment: ~100%
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