Form-factors and Profiles of SiP Modules of WiFi-Only or WiFi/Bluetooth-Combo

•SiP circuitry only
–Occupied area: 100~200mm^2
–Thickness: 1~2mm
•Both SiP and out-of-package circuitry
–Percentage occupied area of SiP module with rest out-of-package components, relative to the occupied area of the circuitry by Direct-Chip-Attachment: ~50%
–Percentage thickness of SiP module with rest out-of-package components, relative to the occupied area of the circuitry by Direct-Chip-Attachment: ~100%