SoC vs. SiP vs. SoB

•System point of view
–SoC: System on single chip
–SiP: System in single package
–SoB: System on a single board
•Material point of view
–IC: Fabless/ Foundry/ Package-House
–Multi-Chip Module: Module-House
–Multi-Module Assembly: Assembly-House
•Structure point of view
–3D IC: Moore's law
–3D MCM: Cost down
–Assembly with single multiple-in-one IC or MCM: Miniaturization