FCC versus WiFi

•FCC
–Side-effect (Interference) checking
–Government Regulation
–Must do
•WiFi
–Main-effect (Interoperability) checking
–Alliance Certification
–Should do

SoC vs. SiP vs. SoB

•System point of view
–SoC: System on single chip
–SiP: System in single package
–SoB: System on a single board
•Material point of view
–IC: Fabless/ Foundry/ Package-House
–Multi-Chip Module: Module-House
–Multi-Module Assembly: Assembly-House
•Structure point of view
–3D IC: Moore's law
–3D MCM: Cost down
–Assembly with single multiple-in-one IC or MCM: Miniaturization

There are two PCIe slots in Netbook/Notebook.

•Prepared for
–(11g -->)11n?
–11g+BT2/EDR (-->11n+BT3/HS)?
–16e (-->16m)?
–HSPA (-->LTE)?

Next Generation TV

•High-definition TV
•Digital TV
•Mobile DTV
•High-definition DTV
•Mobile HDTV (or High-definition MDTV)

Digital Communications

•data compression (or source coding)/ signal processing /channel coding
•video compression (or source video coding)/ image processing/ channel video coding
•audio compression (or source audio coding)/ sound processing/ channel audio coding

線路(Circuitry)

•工法(Methodology)
–塗(Painting/ Filling)
–鍍(Plating/ Coating)
–染(Dying/ Finishing)
•技術(Technology)
–印刷(Printing)
–沉積(Deposition)
–離子佈植(Ion-Implantation)
•製程(Processing)
–厚膜(Thick-Film)
–薄膜(Thin-Film)
–半導體(Semi-conductor)

Printed Wire Boards

•Rigid
•Flexible
•Rigid Flexible Complex

Substrate Materials

•Polytetrafluoroethylene, PTFE, 聚四氟乙烯
–Dk~2.02
–Df~0.00022
–Ex. Dupont/TEFLON
•Polyphenylene oxide, PPO, 聚苯醚
–Dk~3.2
–Df~0.002
–Ex. GE/GETEK
•Polyphenylene ether, PPE, 聚苯醚
–Dk~3.5
–Df~0.002
–Ex. Panasonic/MEGTRON
•Liquid crystal polymer, LCP, 液晶聚合樹脂
–Dk~3
–Df~0.003
–Ex. Rogers/ULTRALAM

重要工藝

•玻璃器(glass-ware, Egypt?)<-->氧化矽(silica)電路基板
•陶瓷器(ceramic-ware, China?)<-->氧化鋁(alumina)電路基板
•漆器(lacquer-ware, Japan?)<-->塑膠(resin)電路基板

Microwave or Wireless

•microwave
–industrial; military; aerospace
–out-door; long range
–antenna: directional; bean-forming; smart
–propagation: one line-of-sight direct path with one or few indirect paths
–circuit: dual-layer ceramic substrate based printed circuit
–circuit miniaturization: thick-film; thin-film; microwave integrated circuit
•wireless
–commercial
–in-house; short range
–propagation: multipath
–antenna: omni-directional; diversity or multiplexing; dumb
–circuit: multi-layer organic substrate based printed circuit
–circuit miniaturization: SMD; RF integrated circuit

風水

•群體個體關係 - 與共關係
–(大樓環境vs.大樓)(大樓vs.房間)(房間vs.座位)
•客體主體關係 - 消長關係
–(環境中其他大樓vs.本大樓)(其他房間vs.本房間)(其他座位vs.本座位)

Probing

•Open/Short Test
•Leakage Test
•DC Test:
–C-V characteristics (Resistance)
•RF Test:
–reflection coefficient (S11)
–transmission coefficient (S21)

Specifications of RF Powers

•Radiated powers Including peak antenna gain and cable loss (tested by using standard horn at peak direction over free space):
–Effective Radiated Power
–System Sensitivity
•Conducted powers excluding antenna gain and cable loss (tested and referred to transmitter output port or receiver input port):
–Maximum Transmitter Output Power
–Minimum Receiver Input Power
•Powers regarding isotropic antenna:
–Effective Isotropic Radiated Power (tested at the position of transmission port of replaced transmitting antenna, by using a termination and directional coupler)
–Effective Isotropic Sensitivity (tested at the position of reception port of replaced receiving antenna, by using a stimulus and directional coupler)
•Powers regarding real antenna:
–Total Radiated Power (summate the powers tested from receiving standard horn which aiming at all directions of real transmitting antenna in real environment)
–Total Isotropic Sensitivity (test the power from real receiving antenna in real environment, which is aimed by transmitting standard horn, the tested power is to be offset by real receiving antenna average gain of all directions of it)

System Integration Support Techniques

1) RF management
1-1) Antenna
1-2) Antenna Switch
2) Power management
2-1) Power Convertor
2-2) Power Switch
3) Interface management
3-1) Interface Bridge
3-2) Interface Switch

Quality and Reliability

•Who do Performance Verification Test and Environmental Stress Screen?
–User vs. Producer
–System-maker vs. Component-maker
–Critical-component-maker vs. Non-critical-component-maker