CAE/CAD/CAM for SiP module

•Computer Aided Engineering
–In-module RF printed-circuit modeling and simulation
–In-module signal-integrity, power-integrity and electro-magnetic-interference modeling and simulation
–In-module thermal modeling and simulation
–In-module mechanical modeling and simulation
•Computer Aided Design
–Module layout and routing
•Computer Aided Manufacturing
–Module array layout for the convenience and economy of PCB fabrication and PCBA assembling